The global hermetic packaging market size stood at USD 3.95 billion in 2023. The market revenue is anticipated to rise from USD 4.21 billion in 2024 to USD 7.31 billion by 2032, registering a CAGR of 7.14% from 2024 to 2032.

Hermetic packaging is widely used to protect electronic components from corrosive environments. An increase in research and development initiatives in the aerospace and defense sector is boosting the adoption of hermetic packaging solutions. Rising emphasis on sustainable packaging solutions to reduce environmental issues is propelling market expansion.

The COVID-19 pandemic negatively impacted the market’s growth due to the shutdown of retail stores.

Fortune Business Insights presents this information in their report titled "Hermetic Packaging Market, 2024–2032".

Top Companies in the Hermetic Packaging Market:

• TELEDYNE (U.S.)
• SCHOTT (Germany)
• Amkor Technology, Inc. (U.S.)
• KYOCERA Corporation (Japan)
• Materion Corporation (U.S.)
• Egide (France)
• SGA Technologies (U.K.)
• Complete Hermetics (U.S.)
• Willow Technologies Ltd. (U.K.)
• Mackin Technologies (Japan)

Browse Detail Summary for the Hermetic Packaging Market: https://www.fortunebusinessinsights.com/hermetic-packaging-market-109188****

Segments

Increasing Usage of Ceramic Metal Sealing in Implantable Electronic Devices Propels Segment Growth

By type, the market is classified into co-fired ceramic, metal can, epoxy seal, ceramic metal sealing, and glass metal sealing. The ceramic metal sealing segment accounts for the largest hermetic packaging market share owing to the increasing usage of ceramic metal sealing in implantable electronic devices. Growing preference for ceramic packaging over other materials due to its superior hermetic protection is boosting segment growth.

Surging Need for Excellent Heat Dissipation and High Optical Precision in Sensors Boosts Segment Expansion